Introduction
This download record contains the 3D printable heatsink adapter for Intel® Joule™ Compute Module.
Available Downloads
- OS Independent
- Size: 27.3 KB
- SHA1: 38C945C62432E7FF505DD6BA153F99242FD2DE38
Detailed Description
Note
Intel has discontinued Intel® Galileo development boards, Intel® Edison compute module and developer kits, and Intel® Joule™ compute module and developer kits. There are no further software releases planned for the Intel Galileo, Intel Edison, or Intel Joule platforms.
As of September 15, 2017, Intel archived its online resources and will maintain availability to Intel Galileo, Intel Edison, and Intel Joule forum communities until June 15, 2020. Files licensed under open-source licenses will continue to be generally available in binary and source code on GitHub*.
This file contains computer generated 3D geometry in .STL format that can be used to create an additional, or replacement, heat sink adapter frame for use with the compute module.
While a printed replication may be physically the same form and fit, the choice of material can impact the robustness of the part for any given use case.
This file is provided under the included Creative Commons Attribution 3.0* (unported) License.
See Creating a Thermal Plate Adapter for the Intel® Joule™ Developer Kit article for detailed instructions
This download is valid for the product(s) listed below.
Disclaimers1
Product and Performance Information
Intel is in the process of removing non-inclusive language from our current documentation, user interfaces, and code. Please note that retroactive changes are not always possible, and some non-inclusive language may remain in older documentation, user interfaces, and code.